Our ServicesIntroduce advanced concepts and cutting-edge technology to China's electronics-related industries

• PCB multilayer circuit board equipments and materials

  • Full Automatic Layup & Break Down System
  • Film AOI Machine
  • MLB Bonding Machine
  • CCD Alignment Induction Bonding Machine
  • X-ray Drilling Machine
  • Automatic rivet machine

• IC-substrate packaging substrate equipment and materials

  • Full Automatic Layup & Break Down System
  • X-ray Drilling Machine
  • Vacuum Hot Press Machine
  • Non-contact Vertical Develop Machine
  • Non-contact Vertical Stripping Machine
  • Vertical PTH Machine

• HDI anylayer & MSAP equipment and materials
  

  • Full Automatic Layup & Break Down System
  • Vacuum Hot Press Machine
  • Non-contact Vertical Develop Machine
  • Non-contact Vertical Stripping Machine
  • Non-contact Vertical Flash Etching Machine
  • Vertical PTH Machine

• FPCB soft board equipment and materials

  • Roll to Roll Exposure Machine
  • Automatic Coverlay Bonding Machine

• COF equipment and materials

  • COF special

• PLP equipment and materials

• Semiconductor equipments and materials

  • PLP special

• Others'equipments and materials